元器件封装形式

BGA Ball Grid Array EBGA 680L LBGA 160L PBGA 217L Plastic Ball Grid Array SBGA 192L TSBGA 680L CLCC 2

CNR Communication and Riser Networking Specification Revision 1.2 CPGA Ceramic Pin Grid Array DIP Dual Inline Package DIP-tab Dual Inline Package with Metal Heatsink FBGA FDIP FTO220 Flat Pack 3

HSOP28 ITO220 ITO3p JLCC LCC LDCC LGA LQFP 4

PCDIP PGA Plastic Pin Grid Array PLCC PQFP PSDIP LQFP 100L METAL QUAD 100L PQFP 100L 5

QFP Quad Flat Package SOT220 SOT223 SOT223 SOT23 SOT23/SOT323 SOT25/SOT353 SOT26/SOT363 SOT343 6

SOT523 SOT89 SOT89 Socket 603 Foster LAMINATE TCSP 20L Chip Scale Package TO252 TO263/TO268 7

SO DIMM Small Outline Dual In-line Memory Module SOCKET 370 For intel 370 pin PGA Pentium III & Celeron CPU SOCKET 423 For intel 423 pin PGA Pentium 4 CPU SOCKET 462/SOCKET A For PGA AMD Athlon & Duron CPU SOCKET 7 For intel Pentium & MMX Pentium CPU QFP Quad Flat Package TQFP 100L SBGA 8

SC-70 5L SDIP SIP Single Inline Package SO Small Outline Package SOJ 32L SOJ SOP EIAJ TYPE II 14L 9

SOT220 SSOP 16L SSOP TO18 TO220 TO247 TO264 TO3 10

TO5 TO52 TO71 TO72 TO78 TO8 TO92 TO93 11

TO99 TSOP Thin Small Outline Package TSSOP or TSOP II Thin Shrink Outline Package uBGA Micro Ball Grid Array uBGA Micro Ball Grid Array ZIP Zig-Zag Inline Package C-Bend Lead 12

CERQUAD Ceramic Quad Flat Pack Ceramic Case LAMINATE CSP 112L Chip Scale Package Gull Wing Leads LLP 8La PCI 32bit 5V Peripheral Component Interconnect PCI 64bit 3.3V Peripheral Component Interconnect 13

PCMCIA PDIP PLCC SIMM30 Single In-line Memory Module SIMM72 Single In-line Memory Module SIMM72 Single In-line Memory Module SLOT 1 For intel Pentium II Pentium III & Celeron CPU SLOT A For AMD Athlon CPU 14

SNAPTK SNAPTK SNAPZP SOH 封装 功率 尺寸 0201 1/20W 0402 1/16W 1.0x0.5 0603 1/10W 1.6x0.8 0805 1/8W 2.0x1.2 1206 1/4W 3.2x1.6 1210 3.2x2.5 1812 4.5x3.2 2225 5.6x6.5