SENSING DEVICE AND MANUFACTURING METHOD THEREOF

专利名称：SENSING DEVICE AND MANUFACTURING

METHOD THEREOF

发明人：Chao-Tsung Tseng,Che-Wei Hsu申请号：US17102546申请日：20201124

公开号：US20210159151A1公开日：20210527

专利附图：

摘要：A sensing device includes a sensing chip, which has an active face with a sensingregion and a metal pad region having at least a metal pad thereon; a dielectric layer,which covers a periphery, back surface and a part of the active surface of the sensing chip,and the first face of the dielectric layer has an elevation higher than the active face of thesensing chip and exposes the sensing region of the sensing chip; a first conductive wirelayer and a second conductive wire layer, which are disposed on the first and second facesof the dielectric layer respectively; a conductive pillar, which is disposed within thedielectric layer and connected to the first and second conductive wire layers; and a front-face fan-out circuit, which is connected to the first conductive wire layer and the metalpad of the sensing chip.

申请人：Phoenix Pioneer Technology Co., Ltd.

地址：Hsinchu County TW

国籍：TW

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